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1 : $45.2880
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Rochester Electronics ADXL700WBRWZ
ACCELEROMETER 14.2G SPI 16SOIC
Manufacturer # :ADXL700WBRWZ
Manufacturer :Rochester Electronics
Dasenic # :ADXL700WBRWZ-DS
Datasheet :
ADXL700WBRWZ Datasheet
ADXL700WBRWZ DatasheetCustomer # :
Description : ACCELEROMETER 14.2G SPI 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 45.2880 | $ 45.29 |
| 25+ | $ 44.3790 | $ 1109.48 |
| 100+ | $ 42.5700 | $ 4257 |
| 500+ | $ 40.7610 | $ 20380.5 |
| 1000+ | $ 38.4930 | $ 38493 |
In Stock: 4746
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 45.288
Total :$ 45.29
Delivery :
Payment :
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ADXL700WBRWZ information
Rochester Electronics ADXL700WBRWZ technical specifications, attributes, parameters.
- Category:Sensor Devices/Motion Sensors - Accelerometers
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C
- Features:Selectable Low Pass Filter
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.295", 7.50mm Width)
- Type:Digital
- Output Type:SPI
- Supplier Device Package:16-SOIC
- Axis:X, Y, Z
- Bandwidth:2kHz
- Voltage - Supply:3.3V ~ 5V
- Acceleration Range:±14.2g
- Sensitivity ( L S B/g):-
- Sensitivity (m V/g):1333
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADXL700WBRWZ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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