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1 : $9.1170
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Rochester Electronics ADXL323KCPZ-RL7
SMALL, LOW POWER, 2 AXIS +/ 3 G
Manufacturer # :ADXL323KCPZ-RL7
Manufacturer :Rochester Electronics
Dasenic # :ADXL323KCPZ-RL7-DS
Datasheet :
ADXL323KCPZ-RL7 Datasheet
ADXL323KCPZ-RL7 DatasheetCustomer # :
Description : SMALL, LOW POWER, 2 AXIS +/ 3 G
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 9.1170 | $ 9.12 |
| 25+ | $ 8.9370 | $ 223.43 |
| 100+ | $ 8.5680 | $ 856.8 |
| 500+ | $ 8.2080 | $ 4104 |
| 1000+ | $ 7.7490 | $ 7749 |
In Stock: 1528
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.117
Total :$ 9.12
Delivery :
Payment :
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ADXL323KCPZ-RL7 information
Rochester Electronics ADXL323KCPZ-RL7 technical specifications, attributes, parameters.
- Category:Sensor Devices/Motion Sensors - Accelerometers
- Product Status:Active
- Operating Temperature:-25°C ~ 70°C (TA)
- Features:-
- Mounting Type:Surface Mount
- Package / Case:16-LQFN Exposed Pad, CSP
- Type:Analog
- Output Type:Analog Voltage
- Supplier Device Package:16-LFCSP-LQ (4x4)
- Axis:X, Y
- Bandwidth:5.5kHz
- Voltage - Supply:5.25V
- Acceleration Range:±3.6g
- Sensitivity ( L S B/g):-
- Sensitivity (m V/g):300mV/g
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADXL323KCPZ-RL7 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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