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Onsemi TIG110BF
Manufacturer # :TIG110BF
Manufacturer :Onsemi
Dasenic # :TIG110BF-DS
Datasheet : TIG110BF Datasheet
Customer # :
Description : IGBT 600V 27A 2W TO220
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In Stock: 839
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.0058
Total :$ 3.01
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TIG110BF information
Onsemi TIG110BF technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Obsolete
- Operating Temperature:-
- Mounting Type:Through Hole
- Package / Case:TO-220-3 Full Pack
- Input Type:Standard
- Power - Max:2 W
- Supplier Device Package:TO-220FI(LS)
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):27 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:NPT
- Vce(on) ( Max) @ Vge, Ic:2V @ 15V, 15A
- Current - Collector Pulsed ( Icm):108 A
- Switching Energy:-
- Gate Charge:95 nC
- Td (on/off) @ 25° C:65ns/250ns
- Test Condition:300V, 15A, 30Ohm, 15V
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.29.0095
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TIG110BF provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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