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Onsemi SGL60N90DG3TU
Manufacturer # :SGL60N90DG3TU
Manufacturer :Onsemi
Dasenic # :SGL60N90DG3TU-DS
Datasheet : SGL60N90DG3TU Datasheet
Customer # :
Description : IGBT 900V 60A 180W TO264
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In Stock: 2686
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.24
Total :$ 12.24
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SGL60N90DG3TU information
Onsemi SGL60N90DG3TU technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-264-3, TO-264AA
- Input Type:Standard
- Power - Max:180 W
- Supplier Device Package:TO-264-3
- Reverse Recovery Time (trr):1.5 µs
- Current - Collector ( Ic) ( Max):60 A
- Voltage - Collector Emitter Breakdown ( Max):900 V
- I G B T Type:Trench
- Vce(on) ( Max) @ Vge, Ic:2.7V @ 15V, 60A
- Current - Collector Pulsed ( Icm):120 A
- Switching Energy:-
- Gate Charge:260 nC
- Td (on/off) @ 25° C:-
- Test Condition:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SGL60N90DG3TU provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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