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Rochester Electronics KSC1674YBU

RF 0.02A, VERY HIGH FREQUENCY BA
part number has RoHS
Manufacturer # :KSC1674YBU
Manufacturer :Rochester Electronics
Dasenic # :KSC1674YBU-DS
Customer # :
Description : RF 0.02A, VERY HIGH FREQUENCY BA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0307$ 0.03
25+$ 0.0301$ 0.75
100+$ 0.0289$ 2.89
500+$ 0.0276$ 13.8
1000+$ 0.0261$ 26.1
In Stock: 17090
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0307
Total :$ 0.03
Delivery :
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Payment :
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KSC1674YBU information

  • Rochester Electronics KSC1674YBU technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - RF
  • Product Status:Active
  • Operating Temperature:150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-226-3, TO-92-3 (TO-226AA)
  • Power - Max:250mW
  • Supplier Device Package:TO-92-3
  • Transistor Type:NPN
  • Current - Collector ( Ic) ( Max):20mA
  • Voltage - Collector Emitter Breakdown ( Max):20V
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:120 @ 1mA, 6V
  • Frequency - Transition:600MHz
  • Noise Figure (d B Typ @ f):3dB ~ 5dB @ 100MHz
  • Gain:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
KSC1674YBU provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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