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Onsemi ISL9V2040D3ST
Manufacturer # :ISL9V2040D3ST
Manufacturer :Onsemi
Dasenic # :ISL9V2040D3ST-DS
Datasheet : ISL9V2040D3ST Datasheet
Customer # :
Description : IGBT 430V 10A TO252AA
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In Stock: 13833
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7216
Total :$ 0.72
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ISL9V2040D3ST information
Onsemi ISL9V2040D3ST technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-40°C ~ 175°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63
- Input Type:Logic
- Power - Max:130 W
- Supplier Device Package:TO-252AA
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):10 A
- Voltage - Collector Emitter Breakdown ( Max):430 V
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:1.9V @ 4V, 6A
- Current - Collector Pulsed ( Icm):-
- Switching Energy:-
- Gate Charge:12 nC
- Td (on/off) @ 25° C:-/3.64µs
- Test Condition:300V, 1kOhm, 5V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.29.0095
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ISL9V2040D3ST provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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