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Onsemi HGTP12N60C3D
Manufacturer # :HGTP12N60C3D
Manufacturer :Onsemi
Dasenic # :HGTP12N60C3D-DS
Datasheet : HGTP12N60C3D Datasheet
Customer # :
Description : IGBT 600V 24A TO220-3
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In Stock: 1586
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7932
Total :$ 0.79
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HGTP12N60C3D information
Onsemi HGTP12N60C3D technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-220-3
- Input Type:Standard
- Power - Max:104 W
- Supplier Device Package:TO-220-3
- Reverse Recovery Time (trr):40 ns
- Current - Collector ( Ic) ( Max):24 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:2.2V @ 15V, 15A
- Current - Collector Pulsed ( Icm):96 A
- Switching Energy:380µJ (on), 900µJ (off)
- Gate Charge:48 nC
- Td (on/off) @ 25° C:-
- Test Condition:-
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HGTP12N60C3D provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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