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Onsemi FGP5N60LS
Manufacturer # :FGP5N60LS
Manufacturer :Onsemi
Dasenic # :FGP5N60LS-DS
Datasheet : FGP5N60LS Datasheet
Customer # :
Description : IGBT FIELD STOP 600V 10A TO220-3
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In Stock: 24056
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6822
Total :$ 0.68
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FGP5N60LS information
Onsemi FGP5N60LS technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-220-3
- Input Type:Standard
- Power - Max:83 W
- Supplier Device Package:TO-220-3
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):10 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:Field Stop
- Vce(on) ( Max) @ Vge, Ic:3.2V @ 12V, 14A
- Current - Collector Pulsed ( Icm):36 A
- Switching Energy:38µJ (on), 130µJ (off)
- Gate Charge:18.3 nC
- Td (on/off) @ 25° C:4.3ns/36ns
- Test Condition:400V, 5A, 10Ohm, 15V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FGP5N60LS provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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