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Onsemi FGD3N60LSDTM
Manufacturer # :FGD3N60LSDTM
Manufacturer :Onsemi
Dasenic # :FGD3N60LSDTM-DS
Datasheet : FGD3N60LSDTM Datasheet
Customer # :
Description : IGBT 600V 6A 40W DPAK
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In Stock: 15000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6966
Total :$ 0.70
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FGD3N60LSDTM information
Onsemi FGD3N60LSDTM technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63
- Input Type:Standard
- Power - Max:40 W
- Supplier Device Package:TO-252AA
- Reverse Recovery Time (trr):234 ns
- Current - Collector ( Ic) ( Max):6 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:1.5V @ 10V, 3A
- Current - Collector Pulsed ( Icm):25 A
- Switching Energy:250µJ (on), 1mJ (off)
- Gate Charge:12.5 nC
- Td (on/off) @ 25° C:40ns/600ns
- Test Condition:480V, 3A, 470Ohm, 10V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FGD3N60LSDTM provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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