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Onsemi FGA70N33BTDTU

IGBT 330V 149W TO3P
part number has RoHS
Manufacturer # :FGA70N33BTDTU
Manufacturer :Onsemi
Dasenic # :FGA70N33BTDTU-DS
Customer # :
Description : IGBT 330V 149W TO3P
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 56
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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FGA70N33BTDTU information

  • Onsemi FGA70N33BTDTU technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
  • Product Status:Obsolete
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-3P-3, SC-65-3
  • Input Type:Standard
  • Power - Max:149 W
  • Supplier Device Package:TO-3P
  • Reverse Recovery Time (trr):23 ns
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):330 V
  • I G B T Type:Trench
  • Vce(on) ( Max) @ Vge, Ic:1.7V @ 15V, 70A
  • Current - Collector Pulsed ( Icm):220 A
  • Switching Energy:-
  • Gate Charge:49 nC
  • Td (on/off) @ 25° C:-
  • Test Condition:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FGA70N33BTDTU provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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