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Rochester Electronics MRF6S21100NR1
RF S BAND, N-CHANNEL , TO-270
Manufacturer # :MRF6S21100NR1
Manufacturer :Rochester Electronics
Dasenic # :MRF6S21100NR1-DS
Datasheet :
MRF6S21100NR1 Datasheet
MRF6S21100NR1 DatasheetCustomer # :
Description : RF S BAND, N-CHANNEL , TO-270
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 49.6080 | $ 49.61 |
| 25+ | $ 48.6180 | $ 1215.45 |
| 100+ | $ 46.6290 | $ 4662.9 |
| 500+ | $ 44.6490 | $ 22324.5 |
| 1000+ | $ 42.1650 | $ 42165 |
In Stock: 1836
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 49.608
Total :$ 49.61
Delivery :
Payment :
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MRF6S21100NR1 information
Rochester Electronics MRF6S21100NR1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - RF
- Product Status:Active
- Voltage - Rated:68 V
- Package / Case:TO-270AB
- Frequency:2.11GHz ~ 2.17GHz
- Current Rating ( Amps):10µA
- Supplier Device Package:TO-270 WB-4
- Power - Output:23W
- Transistor Type:LDMOS
- Gain:14.5dB
- Voltage - Test:28 V
- Noise Figure:-
- Current - Test:1.05 A
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:0000.00.0000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MRF6S21100NR1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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