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1 : $6.4800
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Rochester Electronics MPXC2011DT1
PEIZORESISTIVE SENSOR, DIFFERENT
Manufacturer # :MPXC2011DT1
Manufacturer :Rochester Electronics
Dasenic # :MPXC2011DT1-DS
Datasheet :
MPXC2011DT1 Datasheet
MPXC2011DT1 DatasheetCustomer # :
Description : PEIZORESISTIVE SENSOR, DIFFERENT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 6.4800 | $ 6.48 |
| 5+ | $ 6.4710 | $ 32.36 |
| 10+ | $ 6.4170 | $ 64.17 |
| 50+ | $ 6.3900 | $ 319.5 |
In Stock: 5250
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.48
Total :$ 6.48
Delivery :
Payment :
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MPXC2011DT1 information
Rochester Electronics MPXC2011DT1 technical specifications, attributes, parameters.
- Category:Sensor Devices/Pressure Sensors, Transducers
- Product Status:Active
- Operating Temperature:15°C ~ 40°C
- Features:Temperature Compensated
- Package / Case:4-SSIP Module
- Output Type:Wheatstone Bridge
- Termination Style:PC Pin
- Supplier Device Package:-
- Output:0 mV ~ 25 mV (10V)
- Voltage - Supply:3V ~ 10V
- Accuracy:-
- Operating Pressure:1.45PSI (10kPa)
- Port Size:-
- Pressure Type:Differential
- Port Style:Barbless
- Maximum Pressure:10.88PSI (75kPa)
- Applications:Board Mount
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MPXC2011DT1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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