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GigaDevice Semiconductor GD25Q64ESIGR

IC FLASH 64MBIT SPI/QUAD 8SOP
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Manufacturer # :GD25Q64ESIGR
Dasenic # :5220EA-DS
Customer # :
Description : IC FLASH 64MBIT SPI/QUAD 8SOP 8-SOIC (0.209", 5.30mm Width) Tape & Reel (TR) Cut Tape (CT) Dasenic-Reel®
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.053000$ 1.05
10+$ 0.892800$ 8.93
100+$ 0.809100$ 80.91
500+$ 0.786600$ 393.3
1000+$ 0.753300$ 753.3
In Stock: 9942
MOQ :1 PCS
Packaging :8-SOIC (0.209", 5.30mm Width) Tape & Reel (TR) Cut Tape (CT) Dasenic-Reel®
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.053
Total :$ 1.05
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GD25Q64ESIGR information

Product Details
The GigaDevice GD25Q64ESIGR is a 64 Megabit (8 Megabyte) Serial NOR Flash Memory. It is designed to provide high-speed data storage with low power consumption and is suitable for a variety of applications in both consumer and industrial domains. Functions - Flash Memory Storage: Provides non-volatile storage for various applications. - SPI Interface: Operates with a Serial Peripheral Interface (SPI) that allows it to communicate with microcontrollers and processors. - High Speed: Supports multiple modes, with read speeds up to 104 MHz. - Erase and Program: Allows for inline programming and sector-based erasing. - Low Power Consumption: Features a low-active current and an ultra-low standby current. Applications - Consumer Electronics: Used in devices such as smartphones, tablets, and digital cameras for firmware and data storage. - Industrial Control Systems: Suitable for use in automation systems where firmware is stored in non-volatile memory. - Automotive Electronics: Can be integrated into automotive control units to store firmware and configuration data. - Internet of Things (IoT): Used in IoT devices for storing application code and configurations. Alternative Parts Several alternative parts can serve as replacements for the GD25Q64ESIGR based on similar specifications: - Winbond W25Q64: A 64Mbit SPI Flash Memory that offers similar features. - Micron MT25QL64: Another alternative with comparable performance in SPI Flash memory. - Espressif ESP32 Flash: Often used in Wi-Fi and Bluetooth applications that need Flash memory. Embedded Modules Certain embedded systems or boards might include the GD25Q64ESIGR as part of a memory solution: - Microcontroller Development Boards: Boards like Arduino or ESP32 modules might incorporate this memory chip. - Custom PCBs: Many custom printed circuit boards designed for specific applications in IoT or devices may integrate this memory. Related Q&A 1. Q: What is the storage capacity of the GigaDevice GD25Q64ESIGR? A: The GD25Q64ESIGR has a storage capacity of 64 Megabits (8 Megabytes). 2. Q: What kind of interface does the GD25Q64ESIGR use for communication? A: It uses a Serial Peripheral Interface (SPI) for communication. 3. Q: What are the typical applications for using GD25Q64ESIGR? A: It is typically used in consumer electronics, industrial control systems, automotive electronics, and IoT devices. 4. Q: What are some alternatives to the GD25Q64ESIGR? A: Alternatives include the Winbond W25Q64, Micron MT25QL64, and Espressif ESP32 Flash. 5. Q: Why is the GD25Q64ESIGR preferred for embedded systems? A: It is preferred due to its high-speed operation, low power consumption, and reliable non-volatile memory capabilities, making it suitable for various embedded applications.
  • GigaDevice Semiconductor GD25Q64ESIGR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Technology:FLASH - NOR
  • Supplier Device Package:8-SOP
  • Memory Size:64Mbit
  • Memory Type:Non-Volatile
  • Voltage - Supply:2.7V ~ 3.6V
  • Clock Frequency:133 MHz
  • Access Time:7 ns
  • Memory Format:FLASH
  • Memory Interface:SPI - Quad I/O
  • Write Cycle Time - Word, Page:70µs, 2.4ms
  • Base Product Number:GD25Q64
  • Memory Organization:8M x 8
  • Packaging:Dasenic-Reel®
  • Packaging:Cut Tape (CT)
  • Packaging:Tape & Reel (TR)
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