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GigaDevice Semiconductor GD25Q256DFIGR

256Mbit SPI SOP-16-300mil NOR FLASH
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Manufacturer # :GD25Q256DFIGR
Dasenic # :495B58-DS
Customer # :
Description : 256Mbit SPI SOP-16-300mil NOR FLASH SOP-16-300mil
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 3.654200$ 36.54
1000+$ 2.436100$ 2436.1
2000+$ 2.410200$ 4820.4
3000+$ 2.316200$ 6948.6
In Stock: 3054
MOQ :1 PCS
Packaging :SOP-16-300mil
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.6542
Total :$ 3.65
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GD25Q256DFIGR information

Product Details
The GigaDevice GD25Q256DFIGR is a 256Mb (32MB) Serial NOR Flash memory device. It features a high-speed SPI (Serial Peripheral Interface) and is designed for low power consumption and high performance, making it suitable for a range of applications in consumer, industrial, and automotive markets. Functions - Memory Storage: Provides non-volatile storage for firmware, data, and configuration. - High-speed Read/Write Operations: Supports fast read and write operations using the SPI interface. - Single/Dual/Quad SPI: Capable of operating in single, dual, and quad SPI modes for increased data transfer rates. - Erase and Programming: Supports sector and chip erase commands, along with byte, page, and sector programming. - Deep Power-down Mode: Provides a low-power state when the device is not in use, enhancing battery life in portable applications. Applications - Microcontrollers: Used for external memory storage in microcontroller applications. - IoT Devices: Deployed in Internet of Things (IoT) applications for firmware and data storage. - Consumer Electronics: Found in products such as TVs, set-top boxes, and gaming consoles for firmware storage. - Automotive: Utilized in automotive electronics for data logging and firmware storage. - Industrial Equipment: Applied in manufacturing or industrial control systems requiring firmware storage. Alternative Parts - Winbond W25Q256FV: Another 256Mb Serial NOR Flash with SPI interface. - Micron MT25QL256ABA: 256Mb Serial NOR Flash that also supports dual and quad SPI modes. - Adesto Technologies AT25SF256: A similar 256Mb flash memory device with SPI interface. Embedded Modules - Development Boards: Some development kits and boards come with integrated GigaDevice flash memory for prototyping. - Modules: System-on-Module (SoM) architectures might include the GD25Q256DFIGR when high-density storage is required. - Carrier Boards: Some carrier boards for embedded applications may also integrate this flash memory for easy access. Related Q&A Q1: What is the capacity of GigaDevice GD25Q256DFIGR? A1: The GigaDevice GD25Q256DFIGR has a capacity of 256Mb, which is equivalent to 32MB of storage. Q2: What type of interface does the GD25Q256DFIGR use? A2: The GD25Q256DFIGR uses a Serial Peripheral Interface (SPI) for communication, supporting single, dual, and quad modes. Q3: Can the GD25Q256DFIGR be used in automotive applications? A3: Yes, the GD25Q256DFIGR is suitable for automotive applications, providing non-volatile storage for data logging and firmware. Q4: What are the power-saving features of the GD25Q256DFIGR? A4: The GD25Q256DFIGR features a deep power-down mode that significantly reduces power consumption when the device is not in active use. Q5: What are some alternative memory parts to GD25Q256DFIGR? A5: Alternatives to the GD25Q256DFIGR include Winbond W25Q256FV, Micron MT25QL256ABA, and Adesto Technologies AT25SF256, all of which offer similar capacity and functionality.
  • GigaDevice Semiconductor GD25Q256DFIGR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory
  • Product Status:Not For New Designs
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.295", 7.50mm Width)
  • Technology:FLASH - NOR
  • Supplier Device Package:16-SOP
  • Memory Size:256Mbit
  • Memory Type:Non-Volatile
  • Voltage - Supply:2.7V ~ 3.6V
  • Clock Frequency:104 MHz
  • Memory Format:FLASH
  • Memory Interface:SPI - Quad I/O
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Base Product Number:GD25Q256
  • Memory Organization:32M x 8
  • Packaging:Dasenic-Reel®
  • Packaging:Cut Tape (CT)
  • Packaging:Tape & Reel (TR)
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