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GigaDevice Semiconductor GD25LQ128DSIGR

IC FLASH 128MBIT SPI/QUAD 8SOP
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Manufacturer # :GD25LQ128DSIGR
Dasenic # :67A62D-DS
Customer # :
Description : IC FLASH 128MBIT SPI/QUAD 8SOP 8-SOIC (0.209", 5.30mm Width) Tape & Reel (TR) Cut Tape (CT) Dasenic-Reel®
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QuantityUnit PriceTotal
10+$ 1.603200$ 16.03
2000+$ 1.068800$ 2137.6
In Stock: 9600
MOQ :1 PCS
Packaging :8-SOIC (0.209", 5.30mm Width) Tape & Reel (TR) Cut Tape (CT) Dasenic-Reel®
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.6032
Total :$ 1.60
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GD25LQ128DSIGR information

Product Details
The GD25LQ128DSIGR is a 128 Megabit (16 Megabyte) Serial NOR Flash memory device from GigaDevice Semiconductor. It uses the SPI (Serial Peripheral Interface) protocol for communication, offering high-speed read and program operations. This IC is typically used in applications requiring non-volatile storage, and its small form factor makes it suitable for a variety of electronic devices. Functions - Storage Capacity: 128Mb (16MB) - Memory Structure: Supports page programming and block erase. - Interface Type: SPI (Single, Dual, Quad) - Speed: Fast read speeds of up to 104 MHz; supports different speeds based on configuration. - Endurance and Retention: Typically has a high endurance of around 100,000 program/erase cycles and data retention for up to 20 years. - Power Consumption: Low power consumption during operation and a deep power-down mode. Applications - Consumer Electronics: Used in smartphones, tablets, and smart devices for firmware storage. - Automotive: Used in automotive applications for calibration data and configuration storage. - Industrial Control: Suitable for industrial automation systems requiring reliable non-volatile memory. - IoT Devices: Common in Internet of Things applications where updates to firmware and settings are necessary. - Networking: Used in routers, switches, and other networking devices to store configuration data. Alternative Parts - Micron MT25QL128: Another 128Mb flash memory option with similar features. - Winbond W25Q128: A comparable SPI Flash memory device that offers similar size and speed specifications. - Adesto Technologies AT25DF128: A different alternative with SPI interface. - ISSI IS25LP128: Another candidate in the same storage capacity range with comparable performance metrics. Embedded Modules - Development Boards: Typically, the GD25LQ128 can be found on various development boards that support SPI flash, aiding in prototyping and testing. - Embedded System Solutions: Modules or integration with microcontrollers (MCUs) that have built-in support for SPI can effectively work with the GD25LQ128. --- Q&A Q1: What are the primary uses of the GD25LQ128DSIGR flash memory? A1: The GD25LQ128DSIGR is primarily used for non-volatile storage in applications such as consumer electronics, automotive systems, industrial control devices, and IoT products. --- Q2: How does the GD25LQ128DSIGR communicate with microcontrollers? A2: The GD25LQ128DSIGR communicates using the SPI (Serial Peripheral Interface) protocol, which allows for efficient data transfer between the memory and the microcontroller or processor. --- Q3: What is the maximum speed of the GD25LQ128DSIGR, and why is it important? A3: The GD25LQ128DSIGR supports a maximum read speed of up to 104 MHz. High speed is important for applications that require quick data access and high throughput, such as booting firmware in embedded systems. --- Q4: Can you explain the memory endurance and data retention capabilities of the GD25LQ128DSIGR? A4: The GD25LQ128DSIGR typically has an endurance of around 100,000 program/erase cycles and offers data retention for up to 20 years, making it suitable for applications where long-term reliability is essential. --- Q5: Are there any alternatives to the GD25LQ128DSIGR if one needs a similar memory solution? A5: Yes, alternatives include the Micron MT25QL128, Winbond W25Q128, Adesto AT25DF128, and ISSI IS25LP128, which all offer similar memory capacity and SPI interface functionality. ---
  • GigaDevice Semiconductor GD25LQ128DSIGR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory
  • Product Status:Not For New Designs
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Technology:FLASH - NOR
  • Supplier Device Package:8-SOP
  • Memory Size:128Mbit
  • Memory Type:Non-Volatile
  • Voltage - Supply:1.65V ~ 2V
  • Clock Frequency:120 MHz
  • Memory Format:FLASH
  • Memory Interface:SPI - Quad I/O
  • Write Cycle Time - Word, Page:2.4ms
  • Base Product Number:GD25LQ128
  • Memory Organization:16M x 8
  • Packaging:Dasenic-Reel®
  • Packaging:Cut Tape (CT)
  • Packaging:Tape & Reel (TR)
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