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Rochester Electronics LTC2996CDD#PBF
TEMPERATURE SENSOR WITH ALERT OU
Manufacturer # :LTC2996CDD#PBF
Manufacturer :Rochester Electronics
Dasenic # :LTC2996CDD#PBF-DS
Datasheet :
LTC2996CDD#PBF Datasheet
LTC2996CDD#PBF DatasheetCustomer # :
Description : TEMPERATURE SENSOR WITH ALERT OU
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 121+ | $ 2.5110 | $ 303.83 |
In Stock: 1925
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.511
Total :$ 2.51
Delivery :
Payment :
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LTC2996CDD#PBF information
Rochester Electronics LTC2996CDD#PBF technical specifications, attributes, parameters.
- Category:Sensor Devices/Temperature Sensors - Thermostats - Solid State
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Features:Utilizes External Sensor
- Mounting Type:Surface Mount
- Package / Case:10-WFDFN Exposed Pad
- Current - Supply:200µA
- Output Type:Open Drain
- Supplier Device Package:10-DFN (3x3)
- Output:Active High, Active Low
- Voltage - Supply:2.25 V ~ 5.5 V
- Output Function:/OverTemp, /UnderTemp
- Accuracy:±2°C
- Current - Output ( Max):-
- Switching Temperature:-20°C, 70°C
- Trip Temperature Threshold:Cold, Hot
- Selectable Hysteresis:No
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LTC2996CDD#PBF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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