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1 : $283.8600

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Rochester Electronics BLF6G15L-250PBRN,1

RF PFET, 3-ELEMENT, L BAND, SILI
part number has RoHS
Manufacturer # :BLF6G15L-250PBRN,1
Manufacturer :Rochester Electronics
Dasenic # :BLF6G15L-250PBRN,1-DS
Customer # :
Description : RF PFET, 3-ELEMENT, L BAND, SILI
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 283.8600$ 283.86
25+$ 278.1800$ 6954.5
100+$ 266.8200$ 26682
500+$ 255.4800$ 127740
1000+$ 241.2800$ 241280
In Stock: 1502
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 283.86
Total :$ 283.86
Delivery :
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Payment :
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BLF6G15L-250PBRN,1 information

  • Rochester Electronics BLF6G15L-250PBRN,1 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - RF
  • Product Status:Active
  • Voltage - Rated:65 V
  • Package / Case:SOT-1110A
  • Frequency:1.47GHz ~ 1.51GHz
  • Current Rating ( Amps):64A
  • Supplier Device Package:LDMOST
  • Power - Output:60W
  • Transistor Type:LDMOS
  • Gain:18.5dB
  • Voltage - Test:28 V
  • Noise Figure:-
  • Current - Test:1.41 A
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:0000.00.0000
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BLF6G15L-250PBRN,1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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