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Xilinx® XC7K70T-2FBG676C

FBG-676 Programmable Logic Device (CPLDs/FPGAs)
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Manufacturer # :XC7K70T-2FBG676C
Manufacturer :Xilinx®
Dasenic # :2E9581-DS
Customer # :
Description : FBG-676 Programmable Logic Device (CPLDs/FPGAs) FBG-676
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1+$ 256.122000$ 256.12
In Stock: 1560
MOQ :1 PCS
Packaging :FBG-676
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 256.122
Total :$ 256.12
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XC7K70T-2FBG676C information

Product Details
The Xilinx XC7K70T-2FBG676C is a high-performance FPGA designed for various applications requiring flexible and high-speed digital logic. It features a large number of programmable logic cells and advanced I/O capabilities, making it suitable for a variety of tasks, including signal processing, control systems, and communications. Functions - Programmable Logic: The device contains a significant number of configurable logic blocks (CLBs), which can be used to implement various digital circuits. - DSP Slices: It provides dedicated digital signal processing (DSP) slices for efficient implementation of algorithms requiring high-speed arithmetic operations. - Memory Blocks: Integrated block RAM (BRAM) allows for efficient data storage and retrieval operations. - High-Speed Transceivers: Supports multiple high-speed serial data rates for communication protocols. - Flexible I/O Options: Supports LVDS and other I/O standards for adaptability in various designs. Applications - Telecommunications: Utilized in baseband processing and signal modulation/demodulation. - Video Processing: Suitable for real-time video encoding, decoding, and image processing applications. - Automotive: Used in advanced driver-assistance systems (ADAS) and other automotive applications requiring reliable and high-performance computing. - Aerospace and Defense: Ideal for applications in radar systems, electronic warfare, and other mission-critical systems. - Industrial Automation: Suitable for motion control, robotics, and smart factory applications. Alternative Parts - Xilinx XC7K160T: A higher-capacity variant in the Kintex-7 family, offering more resources. - Xilinx XC7A100T: A more cost-effective option with lower performance but still significant resources. - Microsemi SmartFusion 2: An alternative FPGA with integrated ARM Cortex-M3 processors for processing tasks. - Intel/Altera Cyclone V: Another FPGA option targeted towards mid-range applications. Embedded Modules - MicroBlaze Processor: A soft processor core that can be implemented within the FPGA. - XADC (Analog-to-Digital Converter): Integrated ADC for interfacing with analog signals. - GigE Vision: Modules for supporting Gigabit Ethernet and image processing applications. - SERDES: Integrated SERDES (serializer/deserializer) capabilities support high-speed serial interfaces. Related Q&A Q1: What is the key advantage of using the XC7K70T-2FBG676C in applications requiring DSP capabilities? A1: The XC7K70T-2FBG676C features dedicated DSP slices that allow for efficient implementation of complex signal processing algorithms, enabling high-speed arithmetic operations while saving logic resources for other functionalities. Q2: Can the XC7K70T be used in automotive applications? A2: Yes, the XC7K70T is well-suited for automotive applications, including advanced driver-assistance systems (ADAS), due to its high performance, reliability, and flexibility in digital design. Q3: How does the I/O capability of the XC7K70T benefit communication applications? A3: The XC7K70T supports various I/O standards, including LVDS, which enables high-speed connections required for modern communication protocols, improving data transfer rates and signal integrity. Q4: What are some alternatives to the Xilinx XC7K70T for similar applications? A4: Alternatives include the Xilinx XC7K160T for higher capacity, the Xilinx XC7A100T for cost-effective solutions, and Intel/Altera Cyclone V for mid-range FPGA applications. Q5: What is the benefit of integrated block RAM in the XC7K70T? A5: Integrated block RAM provides efficient on-chip storage for data, facilitating quick access and reducing the need for external memory components, which can enhance performance and streamline system design.
  • Xilinx® XC7K70T-2FBG676C technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Field Programmable Gate Arrays (FPGAs)
  • Operating Temperature:0??C ~ 85??C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:676-BBGA, FCBGA
  • Supplier Device Package:676-FCBGA (27x27)
  • Number of I/ O:300
  • Number of L A Bs/ C L Bs:5125
  • Number of Logic Elements/ Cells:65600
  • Total R A M Bits:4976640
  • Voltage Supply:0.97V ~ 1.03V
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