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AMD / Xilinx XC6SLX16-2CSG225I
Manufacturer # :XC6SLX16-2CSG225I
Manufacturer :AMD / Xilinx
Dasenic # :XC6SLX16-2CSG225I-DS
Datasheet : XC6SLX16-2CSG225I Datasheet
Customer # :
Description : IC FPGA 160 I/O 225CSBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6900
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 19.7883
Total :$ 19.79
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XC6SLX16-2CSG225I information
AMD / Xilinx XC6SLX16-2CSG225I technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:-40°C ~ 100°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:225-LFBGA, CSPBGA
- Supplier Device Package:225-CSPBGA (13x13)
- Voltage - Supply:1.14V ~ 1.26V
- Number of I/ O:160
- Number of L A Bs/ C L Bs:1139
- Number of Logic Elements/ Cells:14579
- Number of gates:-
- Total R A M bits:589824
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
XC6SLX16-2CSG225I provided by AMD / Xilinx
Founded in 1984 and headquartered in San Francisco, California, Xilinx, Inc. is the world's leading provider of complete programmable logic solutions.
Xilinx designs and develops programmable logic products, including integrated circuits (ICs), software design tools, predefined system functions delivered as intellectual property (IP) cores, design services, customer training, field engineering and technical support.
Xilinx is renowned as the inventor of FPGA, programmable SoC, and ACAP. With 3,500 patents and 60 industry firsts, Xilinx boasts an impressive history of achievements.
In February 2022, Advanced Micro Devices Inc. completed the acquisition of Xilinx Inc. in a record chip industry deal valued at approximately $50 billion, granting it an extra edge in the crucial data center market.
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