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Xilinx® XC3S400-4FTG256C

IC FPGA 173 I/O 256FTBGA
part number has RoHS
Manufacturer # :XC3S400-4FTG256C
Manufacturer :Xilinx®
Dasenic # :30B6BE-DS
Customer # :
Description : IC FPGA 173 I/O 256FTBGA 256-LBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
2+$ 38.152800$ 76.31
3+$ 31.304700$ 93.91
5+$ 30.326400$ 151.63
7+$ 29.348100$ 205.44
8+$ 28.369800$ 226.96
In Stock: 14625
MOQ :1 PCS
Packaging :256-LBGA
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 38.1528
Total :$ 38.15
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XC3S400-4FTG256C information

Product Details
The Xilinx XC3S400-4FTG256C is a member of the Spartan-3 family of FPGAs (Field Programmable Gate Arrays). It is designed for a variety of digital applications and embedded systems requiring programmable hardware logic. The XC3S400, specifically, features 400,000 system gates, 8,640 logic cells, and numerous I/O pins, offering a flexible platform for custom hardware design. Functions - Programmability: Allows users to create custom digital circuits through hardware description languages (HDLs) such as VHDL or Verilog. - Logic Density: Provides a balance of logic elements and I/O capabilities suitable for moderate complexity designs. - Integrated Features: Includes DSP slices, block RAM, and other built-in components for enhanced functionality. Applications - Embedded Systems: Used in applications that require custom processing capabilities, such as automotive control systems and industrial automation. - Communications: Suitable for networking equipment, routers, and signal processing applications. - Consumer Electronics: Used in devices like multimedia players, smart TVs, and gaming consoles. - Data Processing: Employed in systems requiring complex data computations and real-time processing. Alternative Parts - XC3S200: A lower-density FPGA in the Spartan-3 family with 200,000 system gates. - XC3S500: A higher-density option, offering 500,000 system gates and additional resources. - Artix-7 FPGAs: A more modern alternative from Xilinx with improved performance and lower power consumption. Embedded Modules The XC3S400-4FTG256C can be integrated into various systems with support for: - Embedded processors: MicroBlaze soft processors can be implemented within the FPGA for additional processing capability. - Development boards: The FPGA is often found on development boards that support features like USB, Ethernet, and PCI Express, aiding in rapid prototyping. Q&A Q1: What is the main advantage of using the Xilinx XC3S400 FPGA in a project? A1: The main advantage is its flexibility in hardware programming, allowing developers to customize the digital logic according to specific application needs, along with the integrated features like DSP slices and block RAM for efficient processing. Q2: How many logic cells does the XC3S400-4FTG256C contain? A2: The XC3S400-4FTG256C contains 8,640 logic cells, which helps create complex digital circuits for various applications. Q3: Can the XC3S400 be used for signal processing applications? A3: Yes, the XC3S400 is well-suited for signal processing applications due to its integrated DSP slices, which facilitate efficient implementation of digital filters and signal algorithms. Q4: What development tools can be used with the XC3S400 FPGA? A4: Developers can use Xilinx’s ISE Design Suite for design entry, simulation, and programming of the XC3S400 FPGA. The software supports VHDL and Verilog for hardware description. Q5: Are there any low-power alternatives to the XC3S400? A5: Yes, the Artix-7 series of FPGAs from Xilinx are modern alternatives that provide lower power consumption while offering higher performance compared to the Spartan-3 FPGAs like XC3S400.
  • Xilinx® XC3S400-4FTG256C technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Field Programmable Gate Arrays (FPGAs)
  • Product Status:Active
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FTBGA (17x17)
  • Voltage - Supply:1.14V ~ 1.26V
  • Number of Gates:400000
  • Number of I/ O:173
  • Number of L A Bs/ C L Bs:896
  • Number of Logic Elements/ Cells:8064
  • Total R A M Bits:294912
  • Series:Spartan®-3
  • Packaging:Tray
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