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  • Rochester Electronics BTA208X-600B,127

    NOW WEEN - BTA208X-600B - 3 QUAD
  • part number has RoHS
  • Mfr.Part # :BTA208X-600B,127
  • Manufacturer :Rochester Electronics
  • Dasenic # :BTA208X-600B,127-DS
  • Datasheet :pdf download BTA208X-600B,127 Datasheet
  • Description : NOW WEEN - BTA208X-600B - 3 QUAD
  • Package :-
  • Quantity :
    Unit Price : $ 0.3233Total : $ 0.32
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 9348
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.3233$ 0.32
25 +$ 0.3168$ 7.92
100 +$ 0.3038$ 30.38
500 +$ 0.2910$ 145.50
1000 +$ 0.2748$ 274.80

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Rochester Electronics BTA208X-600B,127 technical specifications, attributes, parameters.
Category:Discrete Semiconductor Devices/Thyristors - TRIACs
Product Status:Active
Operating Temperature:125°C (TJ)
Mounting Type:Through Hole
Package / Case:TO-220-3 Full Pack, Isolated Tab
Supplier Device Package:TO-220F
Configuration:Single
Current - Hold ( Ih) ( Max):60 mA
Voltage - Off State:600 V
Current - On State ( It ( R M S)) ( Max):8 A
Voltage - Gate Trigger ( Vgt) ( Max):1.5 V
Current - Gate Trigger ( Igt) ( Max):50 mA
Current - Non Rep. Surge 50, 60 Hz ( Itsm):65A, 71A
Triac Type:Standard
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
BTA208X-600B,127 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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