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Rochester Electronics BT138-600/DG,127

NOW WEEN - BT138-600 - 4 QUADRAN
part number has RoHS
Manufacturer # :BT138-600/DG,127
Manufacturer :Rochester Electronics
Dasenic # :BT138-600/DG,127-DS
Customer # :
Description : NOW WEEN - BT138-600 - 4 QUADRAN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.3754$ 0.38
25+$ 0.3679$ 9.2
100+$ 0.3529$ 35.29
500+$ 0.3379$ 168.95
1000+$ 0.3191$ 319.1
In Stock: 15000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3754
Total :$ 0.38
Delivery :
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BT138-600/DG,127 information

  • Rochester Electronics BT138-600/DG,127 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Thyristors - TRIACs
  • Product Status:Active
  • Operating Temperature:125°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3
  • Supplier Device Package:TO-220AB
  • Configuration:Single
  • Current - Hold ( Ih) ( Max):30 mA
  • Voltage - Off State:600 V
  • Current - On State ( It ( R M S)) ( Max):12 A
  • Voltage - Gate Trigger ( Vgt) ( Max):1.5 V
  • Current - Gate Trigger ( Igt) ( Max):35 mA
  • Current - Non Rep. Surge 50, 60 Hz ( Itsm):95A, 105A
  • Triac Type:Standard
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
BT138-600/DG,127 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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