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Texas Instruments V62/08602-01XA

HI-REL DEVICE
part number has RoHS
Manufacturer # :V62/08602-01XA
Manufacturer :Texas Instruments
Dasenic # :V62/08602-01XA-DS
Customer # :
Description : HI-REL DEVICE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 6.5113$ 6.51
In Stock: 6533
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.5113
Total :$ 6.51
Delivery :
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V62/08602-01XA information

  • Texas Instruments V62/08602-01XA technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Specialty Logic
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:114-LFBGA
  • Supplier Device Package:114-BGA MICROSTAR (16x5.5)
  • Supply Voltage:2.3V ~ 2.7V
  • Number of Bits:24, 48
  • Logic Type:Registered Buffer with SSTL_2 Compatible I/O for DDR
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
V62/08602-01XA provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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