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Texas Instruments SN74TVC3010DW
IC 10BIT VOLTAGE CLAMP 24-SOIC
Manufacturer # :SN74TVC3010DW
Manufacturer :Texas Instruments
Dasenic # :SN74TVC3010DW-DS
Datasheet :
SN74TVC3010DW Datasheet
SN74TVC3010DW DatasheetCustomer # :
Description : IC 10BIT VOLTAGE CLAMP 24-SOIC
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| Quantity | Unit Price | Total |
| 1+ | $ 0.9990 | $ 1 |
| 25+ | $ 0.9810 | $ 24.53 |
| 100+ | $ 0.9360 | $ 93.6 |
| 500+ | $ 0.8991 | $ 449.55 |
| 1000+ | $ 0.8492 | $ 849.2 |
In Stock: 26690
MOQ :1 PCS
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Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.999
Total :$ 1.00
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SN74TVC3010DW information
Texas Instruments SN74TVC3010DW technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Specialty Logic
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package:24-SOIC
- Supply Voltage:-
- Number of Bits:10
- Logic Type:Voltage Clamp
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SN74TVC3010DW provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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