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Texas Instruments TPD4EUSB30DQAR
Manufacturer # :TPD4EUSB30DQAR
Manufacturer :Texas Instruments
Dasenic # :TPD4EUSB30DQAR-DS
Datasheet : TPD4EUSB30DQAR Datasheet
Customer # :
Description : TVS DIODE 5.5VWM 8VC 10USON 10-UFDFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 5861
MOQ :1 PCS
Packaging :10-UFDFN
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.72
Total :$ 0.72
Delivery :
Payment :
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TPD4EUSB30DQAR information
Texas Instruments TPD4EUSB30DQAR technical specifications, attributes, parameters.
- Category:Circuit Protection Devices/TVS - Diodes
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:10-UFDFN
- Type:Steering (Rail to Rail)
- Capacitance @ Frequency:-
- Supplier Device Package:10-USON (2.5x1)
- Unidirectional Channels:4
- Voltage - Reverse Standoff ( Typ):5.5V (Max)
- Voltage - Breakdown ( Min):7V
- Voltage - Clamping ( Max) @ Ipp:8V
- Current - Peak Pulse (10/1000µs):1A (8/20µs)
- Power - Peak Pulse:45W
- Power Line Protection:Yes
- Bidirectional Channels:-
- Applications:General Purpose
TPD4EUSB30DQAR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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