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Rochester Electronics TP3057N/NOPB

PCM CODEC, A-LAW, 1-FUNC, PDIP16
part number has RoHS
Manufacturer # :TP3057N/NOPB
Manufacturer :Rochester Electronics
Dasenic # :TP3057N/NOPB-DS
Customer # :
Description : PCM CODEC, A-LAW, 1-FUNC, PDIP16
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.4840$ 2.48
25+$ 2.4300$ 60.75
100+$ 2.3310$ 233.1
500+$ 2.2320$ 1116
1000+$ 2.1150$ 2115
In Stock: 26408
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.484
Total :$ 2.48
Delivery :
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Payment :
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TP3057N/NOPB information

  • Rochester Electronics TP3057N/NOPB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - CODECs
  • Product Status:Active
  • Operating Temperature:-25°C ~ 125°C
  • Mounting Type:Through Hole
  • Package / Case:16-DIP (0.300", 7.62mm)
  • Type:PCM, Filter
  • Supplier Device Package:16-PDIP
  • Resolution ( Bits):-
  • Data Interface:Serial
  • Voltage - Supply, Analog:5V
  • Voltage - Supply, Digital:5V
  • Number of A D Cs / D A Cs:1 / 2
  • Sigma Delta:No
  • S/ N Ratio, A D Cs / D A Cs (db) Typ:-
  • Dynamic Range, A D Cs / D A Cs (db) Typ:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TP3057N/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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