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Texas Instruments TMAG5273A2QDBVR
Manufacturer # :TMAG5273A2QDBVR
Manufacturer :Texas Instruments
Dasenic # :TMAG5273A2QDBVR-DS
Datasheet : TMAG5273A2QDBVR Datasheet
Customer # :
Description : LOW-POWER LINEAR 3D HALL-EFFECT
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In Stock: 7962
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.053
Total :$ 1.05
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TMAG5273A2QDBVR information
Texas Instruments TMAG5273A2QDBVR technical specifications, attributes, parameters.
- Category:Sensor Devices/Magnetic Sensors - Linear, Compass (ICs)
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Features:Sleep Mode, Temperature Compensated
- Mounting Type:Surface Mount
- Package / Case:SOT-23-6
- Technology:Hall Effect
- Output Type:I²C
- Supplier Device Package:SOT-23-6
- Resolution:-
- Axis:X, Y, Z
- Bandwidth:-
- Voltage - Supply:1.7V ~ 3.6V
- Current - Supply ( Max):-
- Sensing Range:±133mT ~ ±266mT
- Current - Output ( Max):2mA
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMAG5273A2QDBVR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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