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Texas Instruments TMAG5124H1CQDBZR
Manufacturer # :TMAG5124H1CQDBZR
Manufacturer :Texas Instruments
Dasenic # :TMAG5124H1CQDBZR-DS
Datasheet : TMAG5124H1CQDBZR Datasheet
Customer # :
Description : MAGNETIC SWITCH UNIPOLAR SOT23-3
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In Stock: 8910
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.666
Total :$ 0.67
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TMAG5124H1CQDBZR information
Texas Instruments TMAG5124H1CQDBZR technical specifications, attributes, parameters.
- Category:Sensor Devices/Magnetic Sensors - Switches (Solid State)
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Features:-
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Technology:Hall Effect
- Output Type:Current Source
- Supplier Device Package:SOT-23-3
- Polarization:South Pole
- Voltage - Supply:2.5V ~ 38V
- Current - Supply ( Max):17mA
- Sensing Range:16.1mT Trip, 11.4mT Release
- Current - Output ( Max):7.3mA
- Test Condition:-40°C ~ 125°C
- Function:Unipolar Switch
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMAG5124H1CQDBZR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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