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Texas Instruments SN74SSTEB32866ZWLR
Manufacturer # :SN74SSTEB32866ZWLR
Manufacturer :Texas Instruments
Dasenic # :SN74SSTEB32866ZWLR-DS
Datasheet : SN74SSTEB32866ZWLR Datasheet
Customer # :
Description : 1.5-V/1.8-V 25-bit configurable registered buffer with address-parity test
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In Stock: 46073
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 3.0438
Total :$ 3.04
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SN74SSTEB32866ZWLR information
Texas Instruments SN74SSTEB32866ZWLR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Specialty Logic
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:96-LFBGA
- Supplier Device Package:96-BGA (13.5x5.5)
- Supply Voltage:1.425V ~ 1.575V
- Number of Bits:25
- Logic Type:Configurable Buffer with Address-Parity Test
- Base Product Number:74SSTEB32866
- Packaging:Tape & Reel (TR)
- Packaging:Cut Tape (CT)
- Packaging:Dasenic-Reel®
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74SSTEB32866ZWLR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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