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Texas Instruments SN74HC684NG4
Manufacturer # :SN74HC684NG4
Manufacturer :Texas Instruments
Dasenic # :SN74HC684NG4-DS
Datasheet : SN74HC684NG4 Datasheet
Customer # :
Description : IC COMPARATOR MAGNITUDE 8B 20DIP
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In Stock: 1594
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.6095
Total :$ 12.61
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SN74HC684NG4 information
Texas Instruments SN74HC684NG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Comparators
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Through Hole
- Package / Case:20-DIP (0.300", 7.62mm)
- Type:Magnitude Comparator
- Supplier Device Package:20-PDIP
- Output:Active Low
- Voltage - Supply:2V ~ 6V
- Number of Bits:8
- Current - Output High, Low:5.2mA, 5.2mA
- Output Function:A=B, A>B
- Max Propagation Delay @ V, Max C L:47ns @ 6V, 50pF
- Current - Quiescent ( Iq):-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74HC684NG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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