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Texas Instruments PDRV5023BIQLPG
Manufacturer # :PDRV5023BIQLPG
Manufacturer :Texas Instruments
Dasenic # :PDRV5023BIQLPG-DS
Datasheet : PDRV5023BIQLPG Datasheet
Customer # :
Description : MAGNETIC SWITCH UNIPOLAR TO92-3
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In Stock: 21
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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PDRV5023BIQLPG information
Texas Instruments PDRV5023BIQLPG technical specifications, attributes, parameters.
- Category:Sensor Devices/Magnetic Sensors - Switches (Solid State)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TA)
- Features:Temperature Compensated
- Mounting Type:Through Hole
- Package / Case:TO-226-3, TO-92-3 Short Body
- Technology:Hall Effect
- Output Type:Open Drain
- Supplier Device Package:TO-92-3
- Polarization:South Pole
- Voltage - Supply:2.5V ~ 38V
- Current - Supply ( Max):2.7mA (Typ)
- Sensing Range:24mT Trip, 3mT Release
- Current - Output ( Max):30mA
- Test Condition:-40°C ~ 125°C
- Function:Unipolar Switch
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
PDRV5023BIQLPG provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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