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1 : $1.1340
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Rochester Electronics LMV1032UP-06/NOPB
LMV1032 AMPLIFIERS FOR 3-WIRE AN
Manufacturer # :LMV1032UP-06/NOPB
Manufacturer :Rochester Electronics
Dasenic # :LMV1032UP-06/NOPB-DS
Datasheet :
LMV1032UP-06/NOPB Datasheet
LMV1032UP-06/NOPB DatasheetCustomer # :
Description : LMV1032 AMPLIFIERS FOR 3-WIRE AN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.1340 | $ 1.13 |
| 25+ | $ 1.1070 | $ 27.68 |
| 100+ | $ 1.0620 | $ 106.2 |
| 500+ | $ 1.0170 | $ 508.5 |
| 1000+ | $ 0.9630 | $ 963 |
In Stock: 6294
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.134
Total :$ 1.13
Delivery :
Payment :
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LMV1032UP-06/NOPB information
Rochester Electronics LMV1032UP-06/NOPB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Microphone
- Mounting Type:Surface Mount
- Package / Case:4-XFBGA, DSBGA
- Type:Class AB
- Output Type:1-Channel (Mono)
- Supplier Device Package:4-DSBGA
- Voltage - Supply:1.7V ~ 5V
- Max Output Power x Channels @ Load:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LMV1032UP-06/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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