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Rochester Electronics LMP2231BMAX/NOPB
Manufacturer # :LMP2231BMAX/NOPB
Manufacturer :Rochester Electronics
Dasenic # :LMP2231BMAX/NOPB-DS
Datasheet : LMP2231BMAX/NOPB Datasheet
Customer # :
Description : IC OPAMP GP 1 CIRCUIT 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.663
Total :$ 0.66
Delivery :
Payment :
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LMP2231BMAX/NOPB information
Rochester Electronics LMP2231BMAX/NOPB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Current - Supply:10µA
- Output Type:Differential, Rail-to-Rail
- Supplier Device Package:8-SOIC
- Number of Circuits:1
- Amplifier Type:General Purpose
- -3db Bandwidth:-
- Current - Output / Channel:30 mA
- Slew Rate:0.058V/µs
- Gain Bandwidth Product:130 kHz
- Current - Input Bias:0.02 pA
- Voltage - Input Offset:10 µV
- Voltage - Supply Span ( Min):1.6 V
- Voltage - Supply Span ( Max):5.5 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LMP2231BMAX/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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