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  • Rochester Electronics LMK01010ISQ/NOPB

    LMK01010 1.6 GHZ HIGH PERFORMANC
  • part number has RoHS
  • Mfr.Part # :LMK01010ISQ/NOPB
  • Manufacturer :Rochester Electronics
  • Dasenic # :LMK01010ISQ/NOPB-DS
  • Datasheet :pdf download LMK01010ISQ/NOPB Datasheet
  • Description : LMK01010 1.6 GHZ HIGH PERFORMANC
  • Package :-
  • Quantity :
    Unit Price : $ 10.341Total : $ 10.34
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 1709
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 10.3410$ 10.34
25 +$ 10.1340$ 253.35
100 +$ 9.7200$ 972.00
500 +$ 9.3060$ 4653.00
1000 +$ 8.7930$ 8793.00

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Rochester Electronics LMK01010ISQ/NOPB technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Clock Buffers, Drivers
Product Status:Active
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:48-WFQFN Exposed Pad
Type:Fanout Buffer (Distribution), Divider
Supplier Device Package:48-WQFN (7x7)
Frequency - Max:1.6 GHz
Number of Circuits:1
Output:LVDS
Voltage - Supply:3.15V ~ 3.45V
Input:Clock
Ratio - Input: Output:1:8
Differential - Input: Output:Yes/Yes
EU RoHS Status:ROHS3 Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product
LMK01010ISQ/NOPB provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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