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Texas Instruments LM57TEPWRQ1
Manufacturer # :LM57TEPWRQ1
Manufacturer :Texas Instruments
Dasenic # :LM57TEPWRQ1-DS
Datasheet : LM57TEPWRQ1 Datasheet
Customer # :
Description : THERMOSTAT PROG ACT HI/LO 8TSSOP
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In Stock: 2196
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 3.24
Total :$ 3.24
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LM57TEPWRQ1 information
Texas Instruments LM57TEPWRQ1 technical specifications, attributes, parameters.
- Category:Sensor Devices/Temperature Sensors - Thermostats - Solid State
- Product Status:Active
- Operating Temperature:-50°C ~ 150°C
- Features:Selectable Trip Point, Trip Test
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP (0.173", 4.40mm Width)
- Current - Supply:24µA
- Output Type:Open Drain, Push-Pull
- Supplier Device Package:8-TSSOP
- Output:Active High, Active Low
- Voltage - Supply:2.4 V ~ 5.5 V
- Output Function:OverTemp, /OverTemp
- Accuracy:±2.3°C
- Current - Output ( Max):5mA
- Switching Temperature:Programmable
- Trip Temperature Threshold:Hot
- Selectable Hysteresis:No
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LM57TEPWRQ1 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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