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Rochester Electronics LM5067MM-2

POWER SUPPLY SUPPORT CIRCUIT, AD
part number has RoHS
Manufacturer # :LM5067MM-2
Manufacturer :Rochester Electronics
Dasenic # :LM5067MM-2-DS
Customer # :
Description : POWER SUPPLY SUPPORT CIRCUIT, AD
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.5660$ 1.57
25+$ 1.5390$ 38.48
100+$ 1.4760$ 147.6
500+$ 1.4130$ 706.5
1000+$ 1.3320$ 1332
In Stock: 36000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.566
Total :$ 1.57
Delivery :
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Payment :
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LM5067MM-2 information

  • Rochester Electronics LM5067MM-2 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Features:Auto Retry
  • Mounting Type:Surface Mount
  • Package / Case:10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Current - Supply:2 mA
  • Type:Hot Swap Controller
  • Number of Channels:1
  • Supplier Device Package:10-VSSOP
  • Internal Switch(s):No
  • Voltage - Supply:-80V ~ -9V
  • Programmable Features:Circuit Breaker, Current Limit, Fault Timeout, OVP, UVLO
  • Current - Output ( Max):-
  • Applications:-48V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LM5067MM-2 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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