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Rochester Electronics LM4855LQ/NOPB

LM4855 INTEGRATED AUDIO AMPLIFIE
part number has RoHS
Manufacturer # :LM4855LQ/NOPB
Manufacturer :Rochester Electronics
Dasenic # :LM4855LQ/NOPB-DS
Customer # :
Description : LM4855 INTEGRATED AUDIO AMPLIFIE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.9630$ 0.96
25+$ 0.9450$ 23.63
100+$ 0.9090$ 90.9
500+$ 0.8667$ 433.35
1000+$ 0.8186$ 818.6
In Stock: 10244
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.963
Total :$ 0.96
Delivery :
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Payment :
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LM4855LQ/NOPB information

  • Rochester Electronics LM4855LQ/NOPB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:Depop, Mute, Shutdown, SPI, Thermal Protection, Volume Control
  • Mounting Type:Surface Mount
  • Package / Case:24-WFQFN Exposed Pad
  • Type:Class AB
  • Output Type:1-Channel (Mono) with Stereo Headphones
  • Supplier Device Package:24-WQFN (4x5)
  • Voltage - Supply:2.6V ~ 5V
  • Max Output Power x Channels @ Load:1.5W x 1 @ 4Ohms; 115mW x 2 @ 32Ohms
  • HTS US:0000.00.0000
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LM4855LQ/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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