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Texas Instruments LM26LVCISDX-120/NOPB

THERMOSTAT 120DEGC OPN DRN 6WSON
part number has RoHS
Manufacturer # :LM26LVCISDX-120/NOPB
Manufacturer :Texas Instruments
Dasenic # :LM26LVCISDX-120/NOPB-DS
Customer # :
Description : THERMOSTAT 120DEGC OPN DRN 6WSON
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 1.6812$ 16.81
4500+$ 0.9340$ 4203
9000+$ 0.9020$ 8118
In Stock: 1298
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.6812
Total :$ 1.68
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LM26LVCISDX-120/NOPB information

  • Texas Instruments LM26LVCISDX-120/NOPB technical specifications, attributes, parameters.
  • Category:Sensor Devices/Temperature Sensors - Thermostats - Solid State
  • Product Status:Active
  • Operating Temperature:-50°C ~ 150°C
  • Features:Trip Test
  • Mounting Type:Surface Mount
  • Package / Case:6-WDFN Exposed Pad
  • Current - Supply:8µA
  • Output Type:Open Drain, Push-Pull
  • Supplier Device Package:6-WSON (2.2x2.5)
  • Output:Active High, Active Low
  • Voltage - Supply:1.6 V ~ 5.5 V
  • Output Function:OverTemp, /OverTemp, VTemp
  • Accuracy:±2.2°C
  • Current - Output ( Max):7mA
  • Switching Temperature:120°C
  • Trip Temperature Threshold:Hot
  • Selectable Hysteresis:No
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LM26LVCISDX-120/NOPB provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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