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Texas Instruments HDC1050DMBT
SENSOR HUMI/TEMP 3.3V I2C 3% SMD
Manufacturer # :HDC1050DMBT
Manufacturer :Texas Instruments
Dasenic # :HDC1050DMBT-DS
Datasheet :
HDC1050DMBT Datasheet
HDC1050DMBT DatasheetCustomer # :
Description : SENSOR HUMI/TEMP 3.3V I2C 3% SMD
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 4.6440 | $ 4.64 |
| 25+ | $ 4.5540 | $ 113.85 |
| 100+ | $ 4.3650 | $ 436.5 |
| 500+ | $ 4.1760 | $ 2088 |
| 1000+ | $ 3.9510 | $ 3951 |
In Stock: 14864
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.644
Total :$ 4.64
Delivery :
Payment :
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HDC1050DMBT information
Texas Instruments HDC1050DMBT technical specifications, attributes, parameters.
- Category:Sensor Devices/Humidity, Moisture Sensors
- Product Status:Not For New Designs
- Operating Temperature:-20°C ~ 60°C
- Mounting Type:Surface Mount
- Package / Case:6-WDFN Exposed Pad
- Output Type:I²C
- Sensitivity:-
- Supplier Device Package:6-WSON (3x3)
- Response Time:30 s
- Output:11b
- Voltage - Supply:2.7V ~ 5.5V
- Sensor Type:Humidity, Temperature
- Accuracy:±3% RH
- Humidity Range:0 ~ 100% RH
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HDC1050DMBT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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