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  • Texas Instruments HDC1000YPAR

    SENSOR HUMI/TEMP 3.3V I2C 3% SMD
  • part number has RoHS
  • Mfr.Part # :HDC1000YPAR
  • Manufacturer :Texas Instruments
  • Dasenic # :HDC1000YPAR-DS
  • Datasheet :pdf download HDC1000YPAR Datasheet
  • Description : SENSOR HUMI/TEMP 3.3V I2C 3% SMD
  • Package :-
  • Quantity :
    Unit Price : $ 6.525Total : $ 6.53
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 9123
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 6.5250$ 6.53
10 +$ 5.5530$ 55.53
100 +$ 4.9950$ 499.50
250 +$ 4.8420$ 1210.50
500 +$ 4.5000$ 2250.00

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Texas Instruments HDC1000YPAR technical specifications, attributes, parameters.
Category:Sensor Devices/Humidity, Moisture Sensors
Product Status:Not For New Designs
Operating Temperature:-40°C ~ 125°C
Mounting Type:Surface Mount
Package / Case:8-WFBGA, DSBGA
Output Type:I²C
Sensitivity:-
Supplier Device Package:8-DSBGA
Response Time:15 s
Output:14b
Voltage - Supply:2.7V ~ 5.5V
Sensor Type:Humidity, Temperature
Accuracy:±3% RH
Humidity Range:0 ~ 100% RH
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Green Symbol: Green and environmentally friendly product
HDC1000YPAR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.

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