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1 : $3.1950
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Rochester Electronics DS90CP02SP/NOPB
IC CROSSPOINT SW 1 X 2:2 28WQFN
Manufacturer # :DS90CP02SP/NOPB
Manufacturer :Rochester Electronics
Dasenic # :DS90CP02SP/NOPB-DS
Datasheet :
DS90CP02SP/NOPB Datasheet
DS90CP02SP/NOPB DatasheetCustomer # :
Description : IC CROSSPOINT SW 1 X 2:2 28WQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 3.1950 | $ 3.2 |
| 25+ | $ 3.1320 | $ 78.3 |
| 100+ | $ 3.0060 | $ 300.6 |
| 500+ | $ 2.8800 | $ 1440 |
| 1000+ | $ 2.7180 | $ 2718 |
In Stock: 11244
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.195
Total :$ 3.19
Delivery :
Payment :
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DS90CP02SP/NOPB information
Rochester Electronics DS90CP02SP/NOPB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:28-UFQFN Exposed Pad
- Type:Crosspoint Switch
- Supplier Device Package:28-UQFN (5x5)
- Voltage - Supply:3V ~ 3.6V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:-
- Circuit:1 x 2:2
- Independent Circuits:1
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DS90CP02SP/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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