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Texas Instruments DRV5032FCDBZT
Manufacturer # :DRV5032FCDBZT
Manufacturer :Texas Instruments
Dasenic # :DRV5032FCDBZT-DS
Datasheet : DRV5032FCDBZT Datasheet
Customer # :
Description : MAGNETIC SWITCH OMNIPOL SOT23-3
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In Stock: 5952
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7292
Total :$ 0.73
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DRV5032FCDBZT information
Texas Instruments DRV5032FCDBZT technical specifications, attributes, parameters.
- Category:Sensor Devices/Magnetic Sensors - Switches (Solid State)
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Technology:Hall Effect
- Output Type:Open Drain
- Supplier Device Package:SOT-23-3
- Polarization:North Pole, South Pole
- Voltage - Supply:1.65V ~ 5.5V
- Current - Supply ( Max):3.5µA
- Sensing Range:±4.8mT Trip, ±0.5mT Release
- Current - Output ( Max):5mA
- Test Condition:25°C
- Function:Omnipolar Switch
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRV5032FCDBZT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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