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Texas Instruments DRV5013BCQLPGMQ1
MAGNETIC SWITCH LATCH TO92-3
Manufacturer # :DRV5013BCQLPGMQ1
Manufacturer :Texas Instruments
Dasenic # :DRV5013BCQLPGMQ1-DS
Datasheet :
DRV5013BCQLPGMQ1 Datasheet
DRV5013BCQLPGMQ1 DatasheetCustomer # :
Description : MAGNETIC SWITCH LATCH TO92-3
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| Quantity | Unit Price | Total |
| 1+ | $ 0.4950 | $ 0.5 |
| 10+ | $ 0.4779 | $ 4.78 |
| 3000+ | $ 0.2025 | $ 607.5 |
| 9000+ | $ 0.1899 | $ 1709.1 |
| 24000+ | $ 0.1881 | $ 4514.4 |
In Stock: 7103
MOQ :1 PCS
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Unit Price :$ 0.495
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DRV5013BCQLPGMQ1 information
Texas Instruments DRV5013BCQLPGMQ1 technical specifications, attributes, parameters.
- Category:Sensor Devices/Magnetic Sensors - Switches (Solid State)
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Features:Temperature Compensated
- Mounting Type:Through Hole
- Package / Case:TO-226-3, TO-92-3 Short Body
- Technology:Hall Effect
- Output Type:Open Drain
- Supplier Device Package:TO-92-3
- Polarization:South Pole
- Voltage - Supply:2.7V ~ 38V
- Current - Supply ( Max):2.7mA (Typ)
- Sensing Range:18mT Trip, -18mT Release
- Current - Output ( Max):30mA
- Test Condition:-40°C ~ 125°C
- Function:Latch
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRV5013BCQLPGMQ1 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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