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Texas Instruments DRV5011ADDBZR
Manufacturer # :DRV5011ADDBZR
Manufacturer :Texas Instruments
Dasenic # :DRV5011ADDBZR-DS
Datasheet : DRV5011ADDBZR Datasheet
Customer # :
Description : MAGNETIC SWITCH LATCH SOT23-3
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In Stock: 37232
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.1901
Total :$ 0.19
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DRV5011ADDBZR information
Texas Instruments DRV5011ADDBZR technical specifications, attributes, parameters.
- Category:Sensor Devices/Magnetic Sensors - Switches (Solid State)
- Product Status:Active
- Operating Temperature:-40°C ~ 135°C (TA)
- Features:-
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Technology:Hall Effect
- Output Type:Push-Pull
- Supplier Device Package:SOT-23-3
- Polarization:North Pole, South Pole
- Voltage - Supply:2.5V ~ 5.5V
- Current - Supply ( Max):3mA
- Sensing Range:±0.6mT Trip, ±3.8mT Release
- Current - Output ( Max):30mA
- Test Condition:-40°C ~ 150°C
- Function:Latch
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRV5011ADDBZR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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