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Rochester Electronics DCV010515DP
Manufacturer # :DCV010515DP
Manufacturer :Rochester Electronics
Dasenic # :DCV010515DP-DS
Datasheet : DCV010515DP Datasheet
Customer # :
Description : DC DC CONVERTER +/-15V 1W
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 14814
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.873
Total :$ 9.87
Delivery :
Payment :
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DCV010515DP information
Rochester Electronics DCV010515DP technical specifications, attributes, parameters.
- Category:Board-Mount Power Supplies/DC DC Converters
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Features:-
- Mounting Type:Through Hole
- Package / Case:14-DIP Module (0.300", 7.62mm), 7 Leads
- Size / Dimension:0.76" L x 0.26" W x 0.21" H (19.2mm x 6.6mm x 5.3mm)
- Approval Agency:-
- Type:Isolated Module
- Voltage - Input ( Max):5.5V
- Supplier Device Package:7-PDIP
- Power ( Watts):1 W
- Number of Outputs:2
- Voltage - Isolation:1.5 kV
- Control Features:-
- Current - Output ( Max):33mA, 33mA
- Voltage - Input ( Min):4.5V
- Voltage - Output 1:15V
- Voltage - Output 2:-15V
- Voltage - Output 3:-
- Voltage - Output 4:-
- Efficiency:85%
- Standard Number:-
- Applications:ITE (Commercial)
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DCV010515DP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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