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Rochester Electronics CP3SP33SMS/NOPB
Manufacturer # :CP3SP33SMS/NOPB
Manufacturer :Rochester Electronics
Dasenic # :CP3SP33SMS/NOPB-DS
Datasheet : CP3SP33SMS/NOPB Datasheet
Customer # :
Description : CP3SP33 PROCESSOR WITH CACHE, CR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 59762
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.0409
Total :$ 5.04
Delivery :
Payment :
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CP3SP33SMS/NOPB information
Rochester Electronics CP3SP33SMS/NOPB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:224-LFBGA
- Interface:ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I²S, Microwire/SPI, UART/USART, USB OTG
- Supplier Device Package:224-NFBGA (13x13)
- Voltage - Supply:3V ~ 3.3V
- Number of I/ O:64
- Core Processor:CR16C
- R A M Size:44K x 8
- Program Memory Type:External Program Memory
- Controller Series:CP3000
- Applications:Connectivity Processor
- HTS US:0000.00.0000
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CP3SP33SMS/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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