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Texas Instruments CD74HCT688EG4
IC COMPARATOR IDENTITY 8B 20DIP
Manufacturer # :CD74HCT688EG4
Manufacturer :Texas Instruments
Dasenic # :CD74HCT688EG4-DS
Datasheet :
CD74HCT688EG4 Datasheet
CD74HCT688EG4 DatasheetCustomer # :
Description : IC COMPARATOR IDENTITY 8B 20DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 1.0632 | $ 10.63 |
| 880+ | $ 0.8860 | $ 779.68 |
In Stock: 939
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.0632
Total :$ 1.06
Delivery :
Payment :
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CD74HCT688EG4 information
Texas Instruments CD74HCT688EG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Comparators
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Through Hole
- Package / Case:20-DIP (0.300", 7.62mm)
- Type:Identity Comparator
- Supplier Device Package:20-PDIP
- Output:Active Low
- Voltage - Supply:4.5V ~ 5.5V
- Number of Bits:8
- Current - Output High, Low:4mA, 4mA
- Output Function:A=B
- Max Propagation Delay @ V, Max C L:34ns @ 4.5V, 50pF
- Current - Quiescent ( Iq):8 µA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD74HCT688EG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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