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Rochester Electronics CD74HCT153M
IC MULTIPLEXER 2 X 4:1 16SOIC
Manufacturer # :CD74HCT153M
Manufacturer :Rochester Electronics
Dasenic # :CD74HCT153M-DS
Datasheet :
CD74HCT153M Datasheet
CD74HCT153M DatasheetCustomer # :
Description : IC MULTIPLEXER 2 X 4:1 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.4750 | $ 0.48 |
| 25+ | $ 0.4655 | $ 11.64 |
| 100+ | $ 0.4465 | $ 44.65 |
| 500+ | $ 0.4275 | $ 213.75 |
| 1000+ | $ 0.4037 | $ 403.7 |
In Stock: 25644
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.475
Total :$ 0.47
Delivery :
Payment :
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CD74HCT153M information
Rochester Electronics CD74HCT153M technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Type:Multiplexer
- Supplier Device Package:16-SOIC
- Voltage - Supply:4.5V ~ 5.5V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:4mA, 4mA
- Circuit:2 x 4:1
- Independent Circuits:1
- EU RoHS Status:RoHS non-compliant
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CD74HCT153M provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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