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1 : $0.2821
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Rochester Electronics CD74HC02E
IC GATE NOR 4CH 2-INP 14DIP
Manufacturer # :CD74HC02E
Manufacturer :Rochester Electronics
Dasenic # :CD74HC02E-DS
Datasheet :
CD74HC02E Datasheet
CD74HC02E DatasheetCustomer # :
Description : IC GATE NOR 4CH 2-INP 14DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 25+ | $ 0.2821 | $ 7.05 |
In Stock: 18410
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2821
Total :$ 0.28
Delivery :
Payment :
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CD74HC02E information
Rochester Electronics CD74HC02E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Gates and Inverters
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C
- Features:-
- Mounting Type:Through Hole
- Package / Case:14-DIP (0.300", 7.62mm)
- Supplier Device Package:14-PDIP
- Number of Circuits:4
- Voltage - Supply:2V ~ 6V
- Number of Inputs:2
- Current - Quiescent ( Max):2 µA
- Logic Type:NOR Gate
- Current - Output High, Low:5.2mA, 5.2mA
- Max Propagation Delay @ V, Max C L:15ns @ 6V, 50pF
- Logic Level - Low:0.5V ~ 1.8V
- Logic Level - High:1.5V ~ 4.2V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD74HC02E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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