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Texas Instruments CD4585BE
Manufacturer # :CD4585BE
Manufacturer :Texas Instruments
Dasenic # :CD4585BE-DS
Datasheet : CD4585BE Datasheet
Customer # :
Description : IC COMPARATOR MAGNITUDE 4B 16DIP
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In Stock: 12300
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3812
Total :$ 0.38
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CD4585BE information
Texas Instruments CD4585BE technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Comparators
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Through Hole
- Package / Case:16-DIP (0.300", 7.62mm)
- Type:Magnitude Comparator
- Supplier Device Package:16-PDIP
- Output:Active High
- Voltage - Supply:3V ~ 18V
- Number of Bits:4
- Current - Output High, Low:4.2mA, 4.2mA
- Output Function:A<B, A=B, A>B
- Max Propagation Delay @ V, Max C L:160ns @ 15V, 50pF
- Current - Quiescent ( Iq):100 µA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD4585BE provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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